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product structure silico n monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 36 tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 14 001 www.rohm.com serial eeprom series standard eeprom i 2 c bus eeprom (2 -wire) br24g xxx - 3a (128k 256k 1m) general description br24 g xxx- 3a is a serial eeprom of i 2 c bus interface method features ? all controls available by 2 ports of serial clock(sc l) and serial data(sda) ? other devices than eeprom can be connected to the same port, saving microcontroller port ? 1.7v to 5.5v single power source operation most suitable for battery us e ? 1.7v to 5.5 v wide limit of operating voltage, possible 1mhz operation ? page write mode useful for initial value write at factory shipment ? self- timed programming cycle ? low current consumption ? p revention of write mistake ? write ( write protect) function added ? prevention of write mistake at low voltage ? more than 1 million write cycles ? more than 40 years data retention ? noise filter built in scl / sda terminal ? initial delivery state ffh page write number of p ages 64 byte 256 byte product number br24g128 -3a br24g256 - 3a br24g1m -3a br24 g 128 - 3a capacity bit f ormat type power s ource voltage package 128kbit 16k 8 b r24 g128 -3a 1. 7 v to 5.5v dip -t8 b r24 g128 f- 3a sop8 b r24 g128 fj -3a sop -j8 b r24 g128 fv- 3a ssop - b8 b r24 g128 fvt- 3a tssop - b8 b r24 g128 fvj -3a tssop - b8 j b r24 g128 fvm- 3a msop8 b r24 g128 nux -3a vson008x2030 package s w (typ ) x d (typ ) x h (max ) fig ure 1 . m sop 8 2.90mm x 4.00mm x 0.90mm sop - j 8 4.90mm x 6.00mm x 1.65mm sop8 5.00mm x 6.20mm x 1.71mm dip - t8 9.30mm x 6.50mm x 7 .10mm ssop - b8 3.00mm x 6.40mm x 1.35mm t s s op - b 8 3.00mm x 6.40mm x 1.20mm ts sop - b8j 3.00mm x 4.90mm x 1.10mm vson008x2030 2.00mm x 3 .00 mm x 0.60mm datashee t
. 2 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com br24 g 256 - 3a capacity bit f ormat type power s ource voltage package 256k bit 32k 8 b r24 g256 -3a 1.7v to 5.5v dip -t8 b r24 g256 f -3a sop8 b r24 g256 fj -3a sop -j8 b r24 g256 f v-3a ssop - b8 b r24 g256 fvt -3a tssop - b8 br24 g 1m - 3a capacity bit f ormat type power s ource voltage package 1m bit 128k 8 b r24 g1m -3a 1.7v to 5.5v dip -t8 b r24 g1m f -3a sop8 b r24 g1m fj -3a sop -j8
. 3 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com absolute maximum ratings (ta=25 c ) parameter symbol rating unit remark supply voltage vcc - 0.3 to + 6.5 v power dissipation pd 0. 45 (sop8) w derate by 4.5mw/c when operating above ta=25c 0. 45 (sop - j8) derate by 4.5mw/c when operating above ta=25c 0. 30 (ssop - b8) derate by 3.0mw/c when operating above ta=25c 0. 33 (tssop - b8) derate by 3.3mw/c when operating above ta=25c 0. 31 (tssop - b8j) derate by 3.1mw/c when operating above ta=25c 0. 31 (msop8) derate by 3.1mw/c when operating above ta=25c 0. 30 (vson008x2030) derate by 3.0mw/c when operating above ta=25c 0. 80 (dip - t8) derate by 8.0mw/c when operating above ta=25c storage temperature ts t g -6 5 to +15 0 c operating temperature topr -40 to + 8 5 c input voltage / output voltage \ - 0.3 to vcc + 1.0 v the max value of input voltage /output voltage is not over 6.5v . when the pulse width is 50ns or less, the min value input v oltage/output v oltage is not lower than - 1.0v . junction temperature t jmax 150 c junction temperature at the storage condition electrostatic discharge voltage (human body model) v esd - 4000 to +4000 v memory c ell c haracteristics (ta=25 c , v cc =1.7v to 5.5v) parameter l imit unit min typ max write cycles ( 1 ) 1,000,000 - - times data retention ( 1 ) 40 - - years ( 1 ) not 100% tested recommended o perating ratings parameter symbol rating unit power source voltage v cc 1.7 to 5.5 v input voltage v in 0 t o v cc dc c haracteristics (unless otherwise specified, ta= - 40c to +8 5 c , v cc = 1.7 v to 5.5v ) parameter symbol limit unit conditions min typ max i nput high v oltage 1 v ih 1 0.7vcc - v cc +1.0 v i n put low v oltage 1 v i l1 - 0.3 ( 2 ) - + 0. 3v cc v o utput low v oltage 1 v ol 1 - - 0.4 v i ol = 3.0 ma , 2.5v Q v cc 5.5v (sda) o utput low v oltage 2 v ol 2 - - 0.2 v i ol = 0.7 ma , 1.7v Q v cc >: 2 .5v (sda) input l eak age c urrent i li - 1 - + 1 a a v out =0 to vcc (sda) supply current (write) i cc1 - - 2.5 ma v cc = 5 .5v, f sc l = 1m hz, t wr = 5ms , byte write, page write br24g128/256 - 3a - - 4.5 v cc = 5 .5v, f sc l = 1m hz, t wr = 5ms , byte write, page write br24g1m - 3a supply current (read) i cc2 - - 2.0 ma v cc =5 .5 v, f sc l = 1m hz random read, current read, sequential read standby current i sb - - 2.0 a v cc =5.5v , sda ? scl= v cc a0, a1, a2=gnd, wp=gnd br24g128/256 - 3a - - 3.0 v cc =5.5v , sda ? scl= v cc a0, a1, a2=gnd, wp=gnd br24g 1m - 3a ( 2 ) when the p ulse width is 50ns or less, it is - 1.0v.
. 4 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com ac c haracteristics (unless otherwise specified, ta = - 40c to +85 c , v cc= 1. 7 v to 5.5v) parameter symbol limit unit min typ max clock f requency f scl - - 1000 khz data c lock ? high ? period t high 0.3 0 - - s data clock ? l ow? period t low 0.5 - - s sda, scl (input) rise time ( 1 ) t r - - 0.12 s sda, scl (input) fall time ( 1 ) t f1 - - 0.12 s sda (output) fall time ( 1 ) t f2 - - 0.12 s start c ondition h old t ime t hd:sta 0.25 - - s star t c ondition s etup t ime t su:sta 0.2 0 - - s input d ata h old t ime t hd:dat 0 - - ns input d ata s etup t ime t su:dat 50 - - ns output d ata d elay t ime t pd 0.05 - 0.45 s output d ata d old t ime t dh 0.05 - - s stop c ondition s etup t ime t su:sto 0.25 - - s bus free t ime t buf 0.5 - - s w rite c ycle t ime t wr - - 5 ms noise spike width (sda, scl) t i - - 0.05 s wp h old t ime t hd:wp 1.0 - - s wp s etup t ime t su:wp 0.1 - - s wp high period t high:wp 1.0 - - s ( 1 ) not 100% tested a c c haracteristics condition parameter symbol condition s unit load capacitance c l 100 pf sda, scl (input) r ise t ime t r 20 n s sda, scl (input) f all t ime t f 1 20 n s input data level v il 1 /v ih 1 0.2v cc /0. 8v cc v input/output data timing reference level - 0.3v cc /0. 7v cc v
. 5 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com serial i nput / o utpu t t iming fig ure 2 - ( e) . wp timing at write cancel fig ure 2 - (d) . wp timing at write execution fig ure 2 - (c) . write cycle timing fig ure 2 - (b) . start - stop bit timing fig ure 2 - (a) . serial input / output timing input read at the rise edge of scl ? data output in sync with the fall of scl scl sda ( ) sda ( ) tr tf1 thigh tsu:dat tlow thd:dat tdh tpd tbuf thd:sta 70% 30% 70% 70% 30% 70% 70% 30% 30% 70% 70% 30% 70% 70% 70% 70% 30% 30% 30% 30% tf2 70 % 70 % tsu:sta thd:sta start condition tssto stop condition 30 30 70 70 d 0 ack twr write data (n - th address) start condition stop condition 70 70 data( 1 ) d 0 ack d 1 data(n) ack twr 30 70 stop condition tdwp tswp 30 70 data( 1 ) d 0 d 1 ack data(n) ack tiwp 70 70 twr 70 (inpt) ( out put)
. 6 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com block diagram fig ure 3 . block diagram pin configuration (top view) pin description s terminal name input/ output descriptions br24g128/256 -3a br24g1m -3a a0 input slave address setting (2) don ? t use (1) a1 input slave address setting (2) a2 input slave address setting (2) gnd - reference voltage of all input / output, 0v sda input/ output serial data input serial data output scl input serial clock inp ut wp input write protect terminal vcc - connect the power source. ( 1 ) pins not used as device address may be set to any of ?h?, 'l', and 'hi - z' . (2) a0, a1 and a2 are not allowed to use as open 1 1 1 2 1 3 1 4 1 1 6 1 5 br24g128 - 3a br24g256 -3a br24g1m -3a a0 1 7 a1 a2 gnd v cc w p scl 8 sda 8 7 6 5 4 3 2 1 sda scl wp v cc nd a2 a1 a0 address decoder word address register data register contro circuit igh votage enerating circuit power source votage detection 8bit ack start stop ( 1 ) ( 2 ) a0 dont use r241 - 3a ( 1 ) 1 4 bit: br24 g128 - 3a 1 5 bit: br24 g256 - 3a 1 7 bit: br24 g1m - 3a 128 kbit , 256kbit, 1m bit eeprom a rray ( 2 ) 14biit 15biit 17biit
. 7 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical performance curve s fig ure 4 . i nput high v oltage 1 vs supply voltage (a0 , a1, a2, scl, sda, wp ) fig ure 5 . i nput low v oltage 1 vs supply voltage (a0 , a1, a2, scl, sda, wp ) fig ure 6 . o utput low v oltage 1 vs output low current (vcc= 2.5 v) fig ure 7 . o utput low v oltage 2 vs output low current (vcc= 1.7 v) 0 1 2 3 4 5 6 0 1 2 3 4 5 6 supply voltage : vcc(v) input low voltage1 : v il1 (v) ta=-40 ta= 25 ta= 85 ta= 25 ta= 85 ta= 25 ta= 85 ta= 25 ta= 85
. 8 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical performance curve s \ fig ure 8 . input l eak age c urrent vs supply voltage ( a0, a1, a2, scl, wp) fig ure 9 . output l eak age c urrent vs supply voltage (sda) fig ure 10 . supply current ( w rite ) vs supply voltage (f scl =1mhz br24g128/256 - 3a) fig ure 1 1 . supply current ( w rite ) vs supply voltage (f scl =1mhz br24g1m - 3a) 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage : vcc(v) input leakage current : i li (a) ta=-40 ta= 25 ta= 85 ta= 25 ta= 85 0 1 2 3 4 5 6 supp votage vcc(v) supp current (write) icc1(ma) spec ta=-40 ta= 25 ta= 85 ta= 25 ta= 85
. 9 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical performance curve s \ fig ure 1 2 . supply current ( r ead ) vs supply voltage (f scl =1mhz) fig ure 1 3 . standby current vs supply voltage (br24g128/256 - 3a) fig ure 1 5 . clock f requency vs supply voltage fig ure 1 4 . standby current vs supply voltage ( br24g1m - 3a) 0.1 1 10 100 1000 10000 0 1 2 3 4 5 6 supply voltage : vcc(v) clock frequency : fscl(khz) spec ta=-40 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85
. 10/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical perfo rmance curve s \ fig ure 1 6 . data c lock high period vs supply voltage fig ure 1 7 . data c lock low period vs supply voltage fig ure 1 9 . start condition hold time vs supply voltage fig ure 1 8 . sda (out put ) fall time vs supply voltage 0 0.1 0.2 0.3 0.4 0 1 2 3 4 5 6 supply voltage : vcc(v) data clock high period : t high (s) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 supp votage vcc(v) data coc low period t low (s) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 supp votage vcc(v) start condition od time t dsta (s) spec ta=-40 ta= 25 ta= 85 0 1 2 3 4 5 6 supp votage vcc(v) sda (otpt) a time t 2 (s) spec ta=-40 ta= 25 ta= 85
. 11 / 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical performance curve s \ fig ure 20 . start condition setup time vs supply voltage 0 0.05 0.1 0.15 0.2 0.25 0.3 0 1 2 3 4 5 6 supply voltage : vcc(v) start condition setup time : t su:sta (s) spec ta=-40 ta= 25 ta= 85 -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage : vcc(v) input data hold time : t hd:dat (ns) spec ta=-40 ta= 25 ta= 85 0 10 20 30 40 50 60 0 1 2 3 4 5 6 supply voltage : vcc(v) input data setup time : t su:dat (ns) spec ta=-40 ta= 25 ta= 85 fig ure 21 . input data hold time vs supply voltage (high) -150 -100 -50 0 50 0 1 2 3 4 5 6 supply voltage : vcc(v) input data hold time : t hd:dat (ns) spec ta=-40 ta= 25 ta= 85
. 12/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com typical performance curve s \ 0 10 20 30 40 50 60 0 1 2 3 4 5 6 supply voltage : vcc(v) input data setup time : t su:dat (ns) spec ta=-40 ta= 25 ta= 85 spec spec ta=-40 ta= 25 ta= 85 spec spec ta=-40 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85
. 13/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com fig ure 3 1 . noise spike width vs supply voltage (scl l ow ) fig ure 30 . noise spike width vs supply voltage (scl h igh ) typical performance curve s \ 0 0.1 0.2 0.3 0.4 0.5 0.6 0 1 2 3 4 5 6 supp votage vcc() us ree time t (s) spec ta=-40 ta= 25 ta= 85 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85 spec ta=-40 ta= 25 ta= 85
. 14/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com fig ure 3 5 . wp s etup t ime vs supply voltage fig ure 3 4 . wp h old t ime vs supply voltage fig ure 3 3 . noise spike width vs supply voltage (sda l ow ) fig ure 3 2 . noise spike width vs supply vol tage (sda h igh ) typical performance curve s \ 0 0.05 0.1 0.15 0.2 0.25 0.3 0 1 2 3 4 5 6 supply voltage : vcc(v) noise spike width(sda low) : t i (s) spec ta=-40 ta= 25 ta= 85 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage : vcc(v) wp hold time : t hd:wp (s) spec ta=-40 ta= 25 ta= 85 -0.3 -0.2 -0.1 0 0.1 0.2 0 1 2 3 4 5 6 supply voltage : vcc(v) wp setup time : t su:wp (s) spec ta=-40 ta= 25 ta= 85 0 0.05 0.1 0.15 0.2 0.25 0.3 0 1 2 3 4 5 6 supply voltage : vcc(v) noise spike width(sda high) : t i (s) spec ta=-40 ta= 25 ta= 85
. 15/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com fig ure 3 6 . wp high per iod vs supply voltage typical performance curve s \ 0 0.2 0.4 0.6 0.8 1 1.2 0 1 2 3 4 5 6 supply voltage : vcc(v) wp high period : t high:wp ( s) spec ta=-40 ta= 25 ta= 85
. 16/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com timing chart 1. i 2 c bus data communication i 2 c bus data communication starts by start condition input, and ends by stop condition input. data is always 8bit long, and acknowledge is always required after each byte. i 2 c bus data communication with several devices is possible by connecting with 2 communication lines: serial data (sda) and serial clock (scl). among the devices, there should be a ?master? that gen erates clock and control communication start and end. the rest become ?slave? which are controlled by an address peculiar to each device, like this eeprom. the device that outputs data to the bus during data communication is called ?transmitter?, and the d evice that receives data is called ?receiver? . . 2. start condition (start bit recognition ) (1) before executing e ach command, start condition (start bit) where sda goes from ' high ' down to ' low ' when scl is ' high ' is necessary. (2) this ic always detects whether sda and scl are in start condition (start bit) or not, therefore, unless this con dition is satisfied, any command cannot be executed. 3. stop condition (stop bit reco gnition ) (1) each command can be ended by a stop condition (stop bit) where sda goes from 'low' to 'high' while scl is 'high' . 4. acknowledge (ack) signal (1) this acknowledge (ack) signal is a software rule to show whether data transfer has been made normally or not. in master - slave communication , the device ( ex . - com sends slave address input for write or read command to this ic ) at the transmitter (sending) side releases the bus after output of 8bit data. (2) the device ( ex. t his ic receives the sla ve address input for write or read command from the - com ) at the receiver (receiving) side sets sda ' low ' during 9 th clock cycle , and outputs acknowledge signal (ack signal) showing that it has receive d the 8bit data. (3) this ic, after recognizing start condition and slave address (8bit), outputs acknowledge signal (ack signal) ' low ' . (4) after receiving 8bit data (word address and write data) during e ach write operation , this ic outputs acknowledg e signal (ack signal) ' low ' . (5) during read operation, this ic outputs 8bit data (read data), and detects acknowledge signal (ack signal) ' low ' . when acknowledge signal (ack signal) is detected, and stop condition is not sent from the master ( - com) side, this ic continues to output data . when acknowledge signal (ack signal) is not detected, this ic stops data transfer, an d recognizes stop c o ndition (stop bit), and ends read operation . then this ic becomes ready for another transmission . 5. device addressing (1) slave address comes after start condition from master. (2) the signi ficant 4 bits of slave address are used for recognizing a device type. the device code of this ic is fixed to ' 1010' . (3) next slave addresses (a2 a1 a0 --- device address) are for selecting devices, and plural ones can be used on a same bus according to the number of device addresses. (4) the most insignificant bit (r/w --- read / write) of slave address is used for designating write or read action, and is as shown below. setting r / w DD to 0 ------- write (setting 0 to word address setting of random read) setting r / w DD to 1 ------- read p0 is page select bit. type slave address maximum number of c onnected buses br24g128 - 3a, br24g256 - 3a, 1 0 1 0 a2 a1 a0 r/ w DD 8 br24g1m - 3a 1 0 1 0 a2 a1 p0 r/ w DD 8 9 8 9 8 9 s p condition condition ack stop ack data data address start r/w ack 1-7 sda scl 1-7 1-7 ig ure 37 . data transfer timing
. 17/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com write command 1. write cycle (1) arbitrary data can be written to eeprom. when writing only 1 byte, b yte w rite is normally used, and when writing continuous data of 2 bytes or more, simultaneous write is possible by page w rite cycle. the maximum number of write bytes is specifie d per device of each capacity. up to 256 arbitrary bytes can be written. in the case of br24g1m -3a (2) during internal write execution, all input commands are ignored, therefore ack is not returned . (3) data is written to the address designated by word ad dress (n - th address) (4) by issuing stop bit after 8bit data input, internal write to memory cell starts. (5) when internal write is started, command is not accepted for t wr (5ms at maximum). (6) using page write cycle, writing in bulk is done as follows : up to 64byte (br24g128 - 3a, br24g256 -3a up to 256byte (br24g1m -3a the bytes in excess overwrite the dat a already sent first . (refer to " internal address i ncrement " ) (7) as for page write cycle of br24g128 - 3a and br24g256- 3a, where 2 or more bytes of data is intended to be written , after the 8 signif icant bits ( br24g128- 3a) or 9 significant bits (br24g256- 3a) of word address are designated arbitrarily, only the value of 6 least significant bits in the address is incremented internally, so that data up to 64 bytes of memory only can be written . (8) as for page write cycle of br24g1m -3a , where 2 or more bytes of data is intended to be written , after the page select bit ?p0? of slave , and the 8 significant bit s of word address are designated arbitra rily, only the value of 8 least significant bits in the address is incremented internally, so that data up to 2 56 bytes of memory only can be written a1 a2 wa 14 1 1 0 0 w r i t e s t a r t r / w s t o p 1st wor d address data slave address a0 d0 a c k sda line a c k a c k note ) wa 0 a c k 2nd word address d7 ( 1 ) wa 1 5 ( 1 ) as for wa14 r24128 - 3a becomes dont care. as for wa15 r24128/256 - 3a becomes dont care. ig ure 3 8 . te write cce fig ure 39 . page write cycle ( 1 ) as for wa14, br24g128 - 3a becomes don't care. as for wa15, br24g128/256 - 3a becomes don' t care. ( 2 ) as for br24g128/256 - 3a becomes (n+63) as for br24g1m - 3a becomes (n+255) w r i t e s t a r t r / w a c k s t o p 1st word address(n) sda line a c k a c k data(n+ 63 ) a c k slave address 1 0 0 0 1 0 a0 a1 a2 wa 14 d0 note ) ( 1 ) data(n) d0 d7 a c k 2nd word address(n) wa 0 ( 2 ) 1 0 0 1 a0 a1 a2 ( 1 ) note ) ig ure 40 . difference of sae address of each tpe wa 1 5 ( 1 ) in r241 - 3a a0 becomes p0.
. 18/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com 2. notes on write cycle continuous input list of numbers of page write number of p ages 64 byte 256 byte product number br24g128 -3a br24g256 - 3a br24g1m -3a the above numbers are maximum bytes for respective types. any bytes below these can be written. in the case br24g256 - 3a, 1 page=64bytes, but the page write cycle time is 5ms at maximum for 64byte bulk write. it does not stand 5ms at maximum 64byte=320ms(max ) 3. internal address increment page write mode (in the case of br24g128 -3a 4. write protect (wp) terminal write protect (wp) function when wp terminal is set at v cc (h level), data rewrite of all addresses is prohibited. when it is set gnd (l level), data rewrite of all address is enabled. be sure to connect this term inal to vcc or gnd, or control it to h level or l level. do not leave it open. in case of us ing it as rom, it is recommended to connect it to pull up or vcc. at extremely low voltage at power on/off, by setting the wp terminal ?h?, write error can be prevented. for example, when it is started from address 3eh, then , increment is made as below, 3eh 3fh 00h 01h ??? please take note. 3eh ??? 3e in hexadecimal, therefore, 0011111 0 becomes a binary number. wa7 wa6 wa5 wa4 wa3 wa2 wa1 wa0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 0 0 1 1 1 1 1 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 increment 3 eh significant bit is fixed. no digit up
. 19/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com read command 1. read cycle read cycle is when d ata of eeprom is read. r ead cycle could be random read cycle or current read cycle. random read cycle is a command to read data by designating a specific address, and is used generally. current read cycle is a command to read data of internal address register without designating an address, and is used when to verify just after write cycle. in both the read cycles, sequential read cycle is available where the next address data can be read in succession . (1) in random read cycle, data of designated word address can be read. (2) when the command just before current read cycle is random read cycle, current read cycle (each including sequential read cycle), data of incremented last read address (n) -th , i.e., data of the (n+1 )- th address is output. (3) when ack signal ' low ' after d0 is detected, and stop condition is not sent from master ( - com) side, the next address data can be read in succession. (4) read cycle is ended by stop condition where ' h ' is input to ack signal after d0 and sda signal goes from ?l? to ?h? while at scl signal is ?h? . (5) when ' h ' is not input to ack signal after d0, se quential read gets in, and the next data is output. therefore, read command cycle cannot be ended. to end read command cycle, be sure to input ' h ' to ack signal after d0, and the stop condition where sda goes from ? l? to ?h? while scl signal is ' h ' . (6) sequential read is ended by stop condition where ' h ' is input to ack signal after arbitrary d0 and sda is asserted from ?l? to ?h? while scl signal is ' h ' . w r i t e s t a r t r / w a c k s t o p 1st word address ? sda line a c k a c k data(n) a c k slave address 1 0 0 1 a0 a1 a2 wa 14 d7 d0 2nd word address ? a c k s t a r t slave address 1 0 0 1 a2 a1 r / w r e a d a0 wa 0 note ) ( 1 ) wa 1 5 ig ure 41 . random read cce ( 1 ) as for wa14 r24128 - 3a become don t care. as for wa15 r24128/256 - 3a become don t care. s t a r t s t o p sda line a c k data(n) a c k slave address 1 0 0 1 a0 a1 a2 d0 d7 r / w r e a d note ) ig ure 42 . current read cce r e a d s t a r t r / w a c k s t o p data(n) sda line a c k a c k data(n+x) a c k slave address 1 0 0 1 a0 a1 a2 d0 d7 d0 d7 note 1 0 0 1 a0 a1 a2 ( 1 )
. 20/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com software reset software reset is executed to avoid malfunction after p ower on , and during command input. software reset has several kinds, and 3 kinds of them are shown in the figure below. ( refer to fig ure 4 5 - (a), fig ure 4 5 - (b), fig ure 4 5 - (c) ) within the dummy clock input area, the sda bus is relea sed (' h ' by pull up) and ack output and read data ' 0 ' (both ' l ' level) may be output from eeprom . therefore , if ' h ' is input forcibly, output may conflict and over current may flow, leading to instantaneous power failure o f system power source or influence upon devices. acknowledge polling during internal write execution, all input commands are ignored, therefore ack is not returned . during internal automatic write execution after write cycle input, next command (slave address) is sent, and if the first ack signal sends back ' l ' , then it means end of write operation , else ' h ' is returned , which means writing is still in progress . by the use of acknowledge polling, next command can be executed without waiting for t wr = 5ms. to write continuously, r/w = 0, then to carry ou t current read cycle after write, slave address with r/w = 1 is sent, and if ack signal sends back ' l ' , then execute word address input and data output and so forth. 1 2 13 14 sc l dummy clock14 s tart2 scl fig ure 45 - (a) . start command from start input. 2 1 8 9 dummy clock 9 start fig ure 45 - (b) . the case of start + dummy cl ock 9 + start+ command input start normal command normal command normal command normal command start 9 sda sda scl sd 1 2 3 8 9 7 fig ure 45 - (c) . start9+ command input normal command normal command sda slave address word address ? s t a r t first write command a c k h a c k l slave address slave address slave address data w rite command during internal write, ack = high is returned . after completion of internal write, ack=low is returned , so input next word address and data in succession. t wr t wr second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l fig ure 46 . case to continuous write by acknowledge polling
. 21/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com wp valid timing (write cancel ) w p is usually fixed to 'h' or 'l', but when wp is used to cancel write cycle and so on, pay attention to the following wp vali d timing. during write cycle execution, inside cancel valid area, by setting wp='h', write cycle can be cancelled. in both byte wri te cycle and page write cycle, the area from the first start condition of command to the rise of clock to take in d0 of data( in page write cycle, the first byte data) is the cancel invalid area. wp input in this area becomes ?don't care?. the area from the rise of scl to take in d0 to the stop condition input is the cancel valid area. furthermore, after the execution of forced end by wp, the ic enters standby status. . command cancel by start condition and stop condition during command input, by continuously inputting start condition and stop condition, command can be cancelled. (figure 4 8 .) however, with in ack output area and during data read, sda bus may output ' l '. i n this case, start condition and stop condition cannot be input, so reset is not available. therefore, execute software reset. w hen command is cancelled by start - stop condition during random read cycle, sequential read cycle, or current read cycle, intern al setting address is not determined . t herefore, it is not possible to carry out current read cycle in succession. t o carry out read cycle in succession, carry out random read cycle . ? rise of d0 ta k en clock scl d0 ack enlarged view scl sda ack d0 ? rise of sda sda wp wp cancel invalid area wp cance l v a lid area data is not written. fig ure 47 . wp valid timing slave address d7 d6 d5 d4 d3 d2 d1 d0 data t wr sda d1 s t a r t a c k l a c k l a c k l a c k l s t o p word address fig ure 48 . case of cancel by start , stop condition during slave address input scl sda 1 1 0 0 start condition stop condition enlarged view wp cancel invalid area
. 22/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com i/o peripheral circuit 1. pull up resistance of sda terminal sda is nmos open drain, so it requires a pull up resistor. as for this resistor value (r pu ), select an appropriate value from microcontroller v il , i l , and v ol -i ol characteristics of this ic. if r pu is large, operating frequency is limited. the smaller the r pu , the larger is the supply current (read) . 2. maximum value of r pu the maximum value of r pu is determined by the following factors. (1) sda rise time to be determined by the capacitance (c bus ) of bus line of r pu and sda should be t r or lower . fu rthermore, ac timing should be satisfied even when sda rise time is late. (2) the bus electric potential a to be determined by input leak total (i l ) of device connected to bus at output of 'h' to sda bus and r pu should sufficiently secure the input 'h' level (v ih ) of microcontroller and eeprom including recommended noise margin of 0.2v cc . v cc - i l r pu - 0.2 v cc R v ih r pu Q 0.8v cc v ih i l ex.) v cc =3v i l =10 a v ih =0.7 v cc f rom (2) Q 300 [k] r pu Q 0.83 0.73 1010 -6 3 . minimum value of r pu the minimum value of r pu is determined by the following factors. (1) when ic outputs low, it should be satisfied that v olmax =0.4v and i olmax =3ma. (2) v olmax = 0.4v should secu re the input 'l' level (v il ) of microcontroller and eeprom including recommended noise margin 0.1v cc . v olmax v il - 0.1 v cc ex.) v cc =3v , v ol =0.4v , i ol =3ma , microcontroller, eeprom v il =0.3v cc and v ol =0.4 [v] v il =0.3 3 =0.9 [v] therefore, the condition (2) is satisfied. 4 . pull up resistance of scl terminal when scl control is made at the cmos output port, there is no need for a pull up resistor. but when there is a t ime where scl becomes 'hi - z', add a pull up resistor. as for the pull up resistor value, one of several k to several ten k is recommended in consideration of drive performance of output port of microcontroller . i ol r pu R v ol i ol v ol r pu Q R 867 [] R 0.4 310 - 3 from (1) microcontroller r pu a sda terminal i l i l bus line capacity c bus fig ure 49 . i/o circuit diagram br24gxx
. 23/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com cautions on microcontroller connection 1. r s in i 2 c bus, it is recommended that sda port is of open drain input/output. however, when using cmos input / output of tri state to sda port, insert a series resistance r s between the pull up resistor r pu and the sda terminal of eeprom. this is to control over current that may occur when pmos of the microcontroller and nmos of eeprom are turned on simultaneously. r s also plays the role of protecting the sda terminal against surge. therefore, even when sd a port is open drain input/output, r s can be used . 2. maximum value of r s the maximum value of r s is determined by the following relations. (1) sda rise time to be determined by the capacitance (c bus ) of bus line and r pu of sda should be t r or lower . furthermore , ac timing should be satisfied even when sda rise time is slow . (2) the bus electric potential a to be determined by r pu and r s the moment when eeprom outputs 'l' to sda bus should sufficiently secure the input 'l' level (v il ) of microcontroller including recommended noise margin of 0.1v cc . 3. minimum value of r s the minimum value of r s is determined by over current at bus collision. when over current flows, noises in power source line and instantaneous power failure of power source may occur. when allowable over current is defined as i, the following relation must be satisfied. determine the allowable current in consideration of the impedance of power source line in set and so forth. set the over current to eeprom to 10ma or lower . r pu microcontroller r s eeprom fig ure 50 . i/o circuit diagram fig ure 51 . input / output collision timing ack ' l ' output of eeprom ' h ' output of microcontroller scl sda microcontroller eeprom 'l' output r s r pu 'h' output over current i fig ure 53 . i/o circuit diagram Q 1.67 [k] Q 0.33 0.4 0.13 2010 3 1.13 0.33 r s r pu 1.1v cc - v il ex. v cc =3v v il =0.3v cc v ol =0.4v r pu =20k r s Q v il v ol 0.1v cc (v cc v ol )r s + v ol +0.1v cc Q v il r pu +r s v cc r s v cc i R 300 [] ex.) v cc =3v, i=10ma r s R 3 1010 - 3 Q i r s R r pu micro controller r s eeprom i ol a bus line capacity c bus v ol v cc v il fig ure 52 . i/o circuit diagram
. 24/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com i/o equivalen ce c ircuit 1. input (a0, a1, a2, scl, wp) power - up/down conditions at power on, the ic?s internal circuits may go through unstable low voltage ar ea as the vcc rises, making the ic?s internal logic circuit not completely reset, hence, malfunction may occur. to prevent this, the ic is equipped with por circuit and lvcc circuit. to assure the operation, observe the following conditions at power on . 1. set sda = ' h ' and scl = ' l ' or ' h ? 2. start power source so as to satisfy the recommended conditions of t r , t off , and v bot for operating por circuit. t off t r v bot 0 v cc 3. set sda and scl so as not to become 'hi - z'. when the above conditions 1 and 2 cannot be observed, take the following countermea sures. (1) in the case when the above condition 1 cannot be observed such that sda becomes 'l' at power on . control scl and sda as shown below, to make scl and sda, 'h' and 'h'. (2) in the case when the above condition 2 ca nnot be observed. after power source becomes s table, execute software reset(p age 19). (3) in the case when the above conditions 1 and 2 cannot be observed. carry out (1 ), and then carry out (2 ). l ow v oltage m alfunction p revention f unction lvc c circuit prevents data rewrite operation at low power, and prevents write error . at lvcc voltage (typ = 1.2v) or below, data rewrite is prevented . n oise c ountermeasures 1. bypass capacitor when noise or surge gets in the po wer source line, malfunction may occur, therefore, it is recommended to connect a by pass capacitor (0.1 f) between the ic?s v cc and gnd pins . connect the capacitor as close to ic as possible. in addition , it is also recommended to connect a bypass capacitor between board?s v cc and gnd. recommended conditions of t r , t off ,v bot t r t off v bot 10ms or below 10ms or larger 0.3v or below 100ms or below 10ms or larger 0.2v or below fig ure 56 . rise waveform diagram t low t su:dat t dh after vcc becomes stable scl v cc sda fig ure 5 7 . when scl= ' h ' and sda= ' l ' t su:dat after vcc becomes stable fig ure 5 8 . when s cl= ' l ' and sda= ' l ' fig ure 54 . input pin circuit diagram fig ure 55 . input / output pin circuit diagram
. 25/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com operational notes 1. descri b ed numeric values and data are design representative values only , and the values are no t guaranteed. 2. we believe that the application circuit examples in this document are recommendable. however, in actual use, confirm characteristics further sufficiently. if changing the fixed number of external parts is desired, make your decision w ith sufficient margin in consideration of static characteristics, transient characteristics, and fluctuations of external parts and our lsi . 3. absolute m aximum r atings if the absolute maximum ratings such as supply voltage, operating temperature range, and so on are exceeded, lsi may be destroyed. do not supply voltage or subject the ic to temperatures exceeding the absolute max imum ratings. in case of fear of exceeding the absolute maximum ratings, take physical safety countermeasures such as adding fuses, and see to it that conditions exceeding the absolute maximum ratings should not be supplied to the lsi . 4. gnd e lectric p otential set the voltage o f gnd terminal lowest at any operating condition. make sure that each terminal voltage is not lower than that of gnd terminal . 5. t hermal d esign use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. 6. short between p ins and m ounting e rrors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins . 7. operating the ic in the presence of strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently .
. 26/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com part numbering b r 2 4 g x x x x x x - 3 a x x x x lineup capacity package orderable part number remark type quantity 128k dip -t8 tube of 2000 br24g128 -3a not halogen free 100% sn sop8 reel of 2500 br24g128 f -3a gte2 halogen free 100% sn sop - j8 br24g128 fj - 3a gte2 halogen free 100% sn ssop -b8 reel of 2500 br24g128 fv -3a gte2 halogen free 100% sn tssop -b8 reel of 3000 br24g128 fvt -3a ge2 halogen free 100% sn tssop - b8j reel of 2500 br24g128 fvj -3a gte2 halogen free 100% sn msop8 re el of 3000 br24g128 fvm -3a gttr halogen free 100% sn vson008x2030 reel of 4000 br24g128 nux -3a ttr halogen free 100% sn 256k dip -t8 tube of 2000 br24g 256 -3a not halogen free 100% sn sop8 reel of 2500 br24g 256f -3a gte2 halogen free 100% sn sop -j8 br2 4g 256fj -3a gte2 halogen free 100% sn ssop -b8 reel of 2500 br24g 256fv -3a gte2 halogen free 100% sn tssop - b8 reel of 3000 br24g 256fvt - 3a ge2 halogen free 100% sn 1m dip -t8 tube of 2000 br24g1m -3a not halogen free 100% sn sop8 reel of 2500 br24g1m f -3 a gte2 halogen free 100% sn sop -j8 br24g1m fj -3a gte2 halogen free 100% sn bus type 2 4 i 2 c operating temperature / operating voltage - 40c to +85 c / 1.7v to 5.5v p rocess code packaging and forming specification e2 : embossed tape and reel ( sop8 , sop - j8, ssop - b8,tssop - b8, tssop - b8j) tr : embossed tape and reel (msop8, vson008x2030) none : tube (dip - t8) revision 128=128k 256=256k 1m=1024k capacity package blank f fv fvj nux : dip - t8 : sop8 : ssop -b8 : tssop - b8j : vson008x2030 fj f vt fvm : sop - j8 : tssop -b8 : msop8 as an exception, vson008x2030 package will be halogen free with ? blank ? g : halogen free blank : t : 100% sn blank :
. 27/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com physical dimension s tape and reel information dip - t8
. 28/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com sop8
. 29/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com
. 30/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com ssop - b8
. 31/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com tssop -b8
. 32/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com tssop - b8j
. 33/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com msop -8
. 34/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com vson008x2030
. 35/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com marking diagrams sop8(top view) part number marking lot number 1pin mark sop - j8(top view) part number marking lot number 1pin mark tssop - b8j(top view ) part number marking lot number 1pin mark vson008x2030 (top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark tsso p - b8(top view) part number marking lot number 1pin mark ssop - b8(top view) part number marking lot number 1pin mark dip - t8 (top view) part number marking lot number
. 36/ 36 b r24gxxx - 3a (128k 25 6k 1m) tsz02201 - 0r2r0g100020 - 1 - 2 18. jun . 201 5 rev.00 6 ? 201 4 rohm co., ltd. all rights reserved. tsz22111 ? 15 001 www.rohm.com marking information capacity product name marking package 128k br24g128a dip -t8 4g12a sop8 sop -j8 4gh a ssop -b8 4g12a t ssop -b8 4g1 2a3 tssop - b8j 4gh a 3 msop8 4g1 2a3 vson008x2030 256k br24g256a dip -t8 4g25a sop8 sop -j8 4gja s ssop-b8 4g25a t ssop -b8 1m br24g1ma dip -t8 4g 1 ma sop8 sop -j8 revision history date revision changes 12 . apr .2012 001 new release 2 5.feb .201 3 002 update some english words , sentences? descriptions , grammar and formatting. update part numbering . delete lineup. 31.may.2013 003 p1 change format of package line - up table. p.3 add vesd in absolute maximum ratings p. 6 add directions in pin descriptions 04. jul .2013 004 p . 4 change start condition setup time from 0.25us to 0.20us. p . 2 6 update part numbering . add lineup table. 02 . may.2014 005 p. 17, 24 ,26 japanese datasheet updated 18.jun.2015 006 p.3 change unit of p ower dissipation from mw to w. p.24 japanese datasheet updated
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range descr ibed in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be us ed on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circui ts, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.
datasheet part number br24g128-3a package dip-t8 unit quantity 2000 minimum package quantity 50 packing type tube constitution materials list inquiry rohs yes br24g128-3a - web page distribution inventory

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